Peculiarities of substrate mass loss under micron pulse laser direct structuring

I. Volyansky, I. Shishkovsky

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, we discuss the issues relevant for the laser-machining process, including the precision and the material removal rate. We have investigated a surface morphology and a mass loss of technical rubber and plastic, industrial silicon and stainless steel ribbon after irradiation by microsecond laser pulses at different pulse energies, repetition rate and irradiation strategies. Laser milling with microsecond pulses (∼ 10 -5-10-6 s) is a thermal material removal process usually associated with detrimental effects such as heat affected zones, a recast layer and debris. It was shown, that process optimization can lead to considerable reduction of the above mentioned negative effects. The mass removal rates are analyzed depending on environment conditions and laser influence regimes. At the optimum operation parameters, have demonstrated that the experimental mass lost is significantly different from the theoretical estimations and this demands a future model improvement.

Original languageEnglish
Title of host publicationFundamentals of Laser-Assisted Micro- and Nanotechnologies 2013
PublisherSPIE
ISBN (Print)9780819499929
DOIs
Publication statusPublished - 2013
Externally publishedYes
EventInternational Symposium on Fundamentals of Laser-Assisted Micro- and Nanotechnologies, FLAMN 2013 - St. Petersburg-Pushkin, Russian Federation
Duration: 24 Jun 201328 Jun 2013

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9065
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceInternational Symposium on Fundamentals of Laser-Assisted Micro- and Nanotechnologies, FLAMN 2013
Country/TerritoryRussian Federation
CitySt. Petersburg-Pushkin
Period24/06/1328/06/13

Keywords

  • Laser assisted micro machining (LAM)
  • laser assisted milling (LAM)
  • laser direct structuring (LDS)
  • mass loss rate
  • submicron laser pulses

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