On the measurement and interpretation of residual stress at the micro-scale

Alexander M. Korsunsky, Edoardo Bemporad, Marco Sebastiani, Felix Hofmann, Saraansh Dave

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


In the present paper we consider two representative methods for residual stress evaluation at the micro-scale: a (semi-)destructive method involving material removal and the measurement of strain relief; and a non-destructive X-ray diffraction technique involving the use of micro-focused synchrotron X-ray beam. A recently developed strain relief approach is described using a Focused Ion Beam (FIB) to create a circular trench of progressively increasing depth around a circular "island". Residual stress is evaluated by the comparison of the strain relief (measured by digital correlation of displacements or strains) with Finite Element simulations. The technique is illustrated for a thin TiN coating layer. The second approach uses focused synchrotron X-ray beams for white beam Laue diffraction. Demonstration experiments described involve in situ loading of commercially pure nickel foil. Procedures for validation and improvement of accuracy are discussed.

Original languageEnglish
Pages (from-to)1-9
Number of pages9
JournalInternational Journal of Modern Physics B
Issue number1-2
Publication statusPublished - 20 Jan 2010
Externally publishedYes


  • Digital image correlation
  • Finite element analysis
  • Focused Ion Beam
  • Residual stress
  • Strain relief


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