Low-dose laser sintering of Cu nanoparticles on the ceramic substrate during ink-jet interconnection

I. Shishkovsky, V. Scherbakof, I. Volyansky

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Citations (Scopus)

Abstract

The deposition of nano-size copper particles was carried out by means of ink-jet printing on the ceramic substrate (silicon and faience) using Nd +3:YAG laser. Glycerin and aqueous based nano copper inks were prepared and were inkjetted in this study. The sintered copper film had a grainy structure with neck-like junctions. The microstructure and soldering properties were examined using XRD, SEM-EDX and optical microscopy. The dependence of the electrical resistance of the ink-jetted copper interconnection lines on the parameters of laser sintering regimes was estimated.

Original languageEnglish
Title of host publicationFundamentals of Laser-Assisted Micro- and Nanotechnologies 2013
PublisherSPIE
ISBN (Print)9780819499929
DOIs
Publication statusPublished - 2013
Externally publishedYes
EventInternational Symposium on Fundamentals of Laser-Assisted Micro- and Nanotechnologies, FLAMN 2013 - St. Petersburg-Pushkin, Russian Federation
Duration: 24 Jun 201328 Jun 2013

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9065
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceInternational Symposium on Fundamentals of Laser-Assisted Micro- and Nanotechnologies, FLAMN 2013
Country/TerritoryRussian Federation
CitySt. Petersburg-Pushkin
Period24/06/1328/06/13

Keywords

  • copper nanoparticles
  • ink-jet
  • interconnection resistance
  • Laser assisted sintering (LAS)

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