A new methodology for in-situ residual stress measurement in MEMS structures

M. Sebastiani, E. Bemporad, G. Melone, L. Rizzi, A. M. Korsunsky

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Citations (Scopus)

Abstract

In this paper, a new approach is presented for local residual stress measurement in MEMS structures. The newly proposed approach involves incremental focused ion beam (FIB) milling of annular trenches at material surface, combined with high resolution SEM imaging and Digital Image Correlation (DIC) analysis for the measurement of the strain relief over the surface of the remaining central pillar. The proposed technique allows investigating the average residual stress on suspended micro-structures, with a spatial resolution lower than 1 μm. Results are presented for residual stress measurement on double clamped micro-beams, whose layers are obtained by DC-sputtering (PVD) deposition. Residual stresses were also independently measured by the conventional curvature method (Stoney's equation) on a similar homogeneous coating obtained by the same deposition parameters and a comparison and discussion of obtained results is performed.

Original languageEnglish
Title of host publicationStress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization
Pages120-126
Number of pages7
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany
Duration: 12 Apr 201014 Apr 2010

Publication series

NameAIP Conference Proceedings
Volume1300
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference11th International Workshop on Stress-Induced Phenomena in Metallization
Country/TerritoryGermany
CityBad Schandau
Period12/04/1014/04/10

Keywords

  • FIB
  • in-situ
  • Residual stress MEMS
  • thin coatings

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